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Junction Temperature Estimation Approach Based on TSEPs in Multichip IGBT Modules
Jianxiong Yang Yanbo Che Li Ran Borong Hu Mingxing Du
Vol. 22, No. 9, pp. 1596-1605, Sep. 2022
10.1007/s43236-022-00465-3
Vol. 22, No. 9, pp. 1596-1605, Sep. 2022
10.1007/s43236-022-00465-3
ISSN : 1598 - 2092
eISSN : 2093 - 4718